功能特點FEATURES：
1. 消除基材表面靜電，清潔活化基材表面，提高基材表面能，提升黏膠于基材的附著力。
Eliminate static electricity on the substrate ,clean the surface of the activated substrate ,improve the surface energy of the substrate ,ａnd improve the adhesion of the adhesive to the substrate.
2. 等離子溫度低，不損傷基材
The plasma temperature is low and does not damage the substrae.
3. 不產(chǎn)生電弧，不損傷被處理產(chǎn)品的芯片
No arcing,no damage to the chip of the processed product.

設(shè)備參數(shù)： PARAMATER

機(jī)器尺寸 Machine size	1250*650*1350 L*W*H(特殊尺寸可定制)
工作臺尺寸 Word table size	400*550mm
工作尺寸 Max word table size	350*450mm
機(jī)器重量 Machine weight	約350KG
電壓/功率 Voltage/power	220V/1.5KW
傳動系統(tǒng) Drive system	伺服控制系統(tǒng) Modular servo control system
傳動部件 Transmission parts	絲桿 Ball screw
移動速度 Moving speed	1-800mm/sec
控制系統(tǒng) Control system	工控主機(jī) Industrial computer
操作界面 Operation interface	VECTRON control software
異常報警功能 Error Alarm	是 Yes
空氣凈化系統(tǒng) Air Fliter System	選配 Optional