功能特點FEATURES：
1. 消除基材表面靜電，清潔活化基材表面，提高基材表面能，提升黏膠于基材的附著力。
Eliminate static electricity on the substrate ,clean the surface of the activated substrate ,improve the surface energy of the substrate ,ａnd improve the adhesion of the adhesive to the substrate.
2. 等離子溫度低，不損傷基材
The plasma temperature is low and does not damage the substrae.
3. 不產生電弧，不損傷被處理產品的芯片
No arcing,no damage to the chip of the processed product.
1. 消除基材表面靜電，清潔活化基材表面，提高基材表面能，提升黏膠于基材的附著力。
Eliminate static electricity on the substrate ,clean the surface of the activated substrate ,improve the surface energy of the substrate ,ａnd improve the adhesion of the adhesive to the substrate.
2. 等離子溫度低，不損傷基材
The plasma temperature is low and does not damage the substrae.
3. 不產生電弧，不損傷被處理產品的芯片
No arcing,no damage to the chip of the processed product.
設備參數： PARAMATER
| 輸入電壓 Input Voltage | VAC | 220±10% Single Phase | |
| 輸入電源頻率Input Frequency | HZ | 50/60 | |
| 輸入電流InputCurrent | AMP | Max 8per a head | |
| 接地電阻值Ground Resistance | Ω | Lower than 10 | |
| 輸入氣體Input Gas | NA | AIR(CDA),CO2,N2,Ar,eTC | |
| 輸入氣壓Gas Pressure | MPA | 0.4～0.6 | |
| 輸入氣體流量GasFlow Rate | LPM | 25～28 | |
| 等離子功率Plasma Output | WATT | 500/1000/1500 | |
| 放電電壓Discharge Voltage | KVOLT | 8～12 | |
| 放電頻率Discharge Freq | KHZ | 30～60 | |
| 噴頭轉速Plasma Revolution | RPM | 1200～3000 | |
| 噴嘴長度Plasma Length | MM | Max.70 | |
| 噴嘴幅寬Plasma Width | MM | 20/40/60/80/100/150 | |
| 噴嘴溫度Operation Ambient Temp | ℃ | 50 | |
| 噴頭數量Discharge Head Quilty | SET | 1 | 2 |
| 噴頭長度Discharge Head Length | METER | Max 8per a head | |
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