OAI Model 800E 型掩模對準(zhǔn)系統(tǒng)

。各種光譜范圍選項:Hg燈:G(436nm),H(405nm)， I(365nm)和310nm線，Hg-Xe燈:260nm和220nm

?；叽绶秶鷱?“8”直徑

。燈功率范圍從200到2000W或LED

。電腦操作和配方存儲

。易于使用的GUI和多功能操縱桿

。手動對齊在頂部和底部雙2 mp GigE攝像機(jī)和機(jī)動的X-Y-Z-Theta舞臺與操縱桿/菜譜操作

。升級到自動對齊w / Cognex軟件升級

。楔自動補(bǔ)償和機(jī)動z軸帶有編碼器和3點(diǎn)水準(zhǔn)升級選項

。紅外光學(xué)背面對齊選擇升級

。接近(20um): 3.0um，軟觸點(diǎn):2.0um，硬觸點(diǎn):1um，真空觸點(diǎn):≤0.5um

。提供正面和背面接觸和對齊0.5 - 1的準(zhǔn)確性

。提供半自動化/研發(fā)和低容量生產(chǎn)模式

。適用于MEMS、半導(dǎo)體、Microfludic納米印記,PSS襯底和CLiPP流程

Model 800E Mask Aligner System

。 Various Spectra Range Options: Hg Lamp: G (436nm), H (405nm), I(365nm) and 310nm lines, Hg-Xe Lamp: 260nm and 220nm
。 Substrate sizes range from 4” to 8” diameter or square
。 Lamp Power range from 200 to 2,000W or LED
。 PC Operation and Recipe Storage
。 Easy to use GUI and Multifunction Joystick
。 Manual Alignment with Top and Bottom Dual 2MP GigE Cameras and Motorized X-Y-Z-Theta Stage with Joystick / Recipe Operation
。 Upgrade to Auto Alignment w/ Cognex Software Upgrade
。 Automated wedge compensation and motorized z-axis with encoder and option for 3 Point Leveling Upgrade
。 IR Optics Backside Alignment Option upgrade
。 Proximity (20um): <3.0um, Soft Contact: <2.0um, Hard contact: 1um and vacuum contact : ≤ 0.5um
。 Provides Front and backside exposure and alignment accuracy of 0.5-1um
。 Available in semi automated / R&D and low volume production modes
。 Applicable for MEMS, Semiconductor, Microfludic, NanoImprinting, PSS Substrate and CLiPP Processes