Drying system
Advantage
The drying system uses IPA and N2 atomization, as well as the shape of a wafer from water.
The technique of surface tension drying
Drying technology suitable for maximum size 300mm wafer
> can be single device or integrated in wet equipment
> the best area of land
Mature process
No water trace
No fragments
Features and advantages
Application
Polished chips, integrated circuits, MEMES, LED, photovoltaic, glass substrates
General characteristics
> can dry 25 to 50 pieces of wafer with a maximum diameter of 300mm at the same time
> for standard high or low side flower baskets
Specifications
Process time: generally < 10="" minutes,="" changed="" by="" the="" menu="" of="" the="" selected="">
Hydrophilic wafer: less than 10 increase @ 0.12 M
Hydrophobic wafer: less than 30 increase @ 0.12 M
Metal content: any metal is less than or equal to 1 - 1010 atoms / cm2
Dry spots: no spots after drying
IPA consumption: less than 30 ml / run
Go to the edge: 3 mm
Graphical user interface
> based on B&R PLC
Edit menu
> > automatic recording (EOR, ERR etc.)
> multilevel cipher
General installation parameters
Size: 660 x 1440 x 2200 (long x wide x high)
Standard voltage: 3 x 400 VAC
Rated power: 50 Hz
Standard current: 3 x 33 A
Train
Operation, maintenance, process training
standard
> CE
> > Semi S2 and S8
> FM 4910
> > SECS/GEM
option
Laminar flow
IPA concentration monitoring system
> hot N2
> UPS component
reliability
MTBF > > 800 H
The average time interval of more than 300 auxiliary > H
But the running time is more than 97%.
The drying system of equipment more relevant information can focus on the website (), now hotline immediately available free solution for semiconductor cleaning equipment.
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