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AutomaticelectrolesselectrolessequipmentAdvantageThewetprocesssystemisusedforelectrolessaluminumplating
Automatic electroless electroless equipment Advantage The wet process system is used for electroless aluminum plating, copper substrate material (Ni, Pd, Au) (metal UBM under convex points) Suitable for size to 300mm wafer The longest service life benefits from the most advanced software and hardware > maximum reliability and compatibility Effective support for using Fraunhofer Technology > maximum capacity More bottomed production costs fully automatic electroless electroless equipment (Hua Xuedu), design and Application A wafer with a maximum high capacity diameter of 300mm, unique software and hardware guarantee Long life and unrivalled low production costs. The real-time analyzer and the optimized dosage of the process have excellent process control ability. Features and advantages application Electroless aluminum and copper substrate materials (Ni, Pd, Au) (metal UBM under bump) General characteristics > for a batch of 25 or 50 pieces of 100-200mm wafer, and a batch of 13 or 26 pieces of 300mm wafer. > for standard high or low side flower baskets Specially designed loading and unloading equipment used to transmit flower baskets Washing machine grip > two different mechanical hand claws, one for preprocessing, and the other for coating process An independent exhaust gas that is safe and effective to discharge gases from acids, bases, neutrality and cyanide Dry and dry process Intelligent self rescue and emergency stop function of silicon wafer > scheduler > vibrating function of wafer > dry Cyanide detector and operator safety protection device A sealed chemical supply tank An automatic cleaning system for adjusting the temperature of each process Lighting system that has no influence on the coating > for clean room grade 10000 or higher clean room > total automatic chemical ratio system: Manually adjusting each different process and batch according to the difference of the product and the reaction time according to the needs Graphical user interface > Windows interface Edit menu > real time flowchart Auto save (EOR, ERR, ChemLog, etc.) > multilevel cipher Process control ability Real-time tracking of batch during the whole process > process parameter tracking, including temperature, flow, resistivity Concentration automatic control system Train Operation, maintenance and process training General installation parameters Dimensions: variable x 2150 x 3050 mm (L x D x H) Line voltage: 3 x 400 VAC Rated power: 50 Hz Rated current: 3 x 100 A (etc.) standard > FM 4910 > > SEMI S2 and S8 > > SECS/GEM > CE Optional > UPS component > wafer ID recognition reliability MTBF >: > 800 H > auxiliary average interval: 300 H Run time: > > 97% No more automatic electroplating equipment can focus on the Nantong semiconductor equipment website ; Now consulting can immediately free access to provides automatic electroplating equipment related programs
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