Automatic electroless electroless equipment
Advantage
The wet process system is used for electroless aluminum plating, copper substrate material (Ni, Pd, Au)
(metal UBM under convex points)
Suitable for size to 300mm wafer
The longest service life benefits from the most advanced software and hardware
> maximum reliability and compatibility
Effective support for using Fraunhofer Technology
> maximum capacity
More bottomed production costs
fully automatic electroless electroless equipment (Hua Xuedu), design and Application
A wafer with a maximum high capacity diameter of 300mm, unique software and hardware guarantee
Long life and unrivalled low production costs.
The real-time analyzer and the optimized dosage of the process have excellent process control ability.
Features and advantages
application
Electroless aluminum and copper substrate materials (Ni, Pd, Au) (metal UBM under bump)
General characteristics
> for a batch of 25 or 50 pieces of 100-200mm wafer, and a batch of 13 or 26 pieces of 300mm wafer.
> for standard high or low side flower baskets
Specially designed loading and unloading equipment used to transmit flower baskets
Washing machine grip
> two different mechanical hａnd claws, one for preprocessing, and the other for coating process
An independent exhaust gas that is safe and effective to discharge gases from acids, bases, neutrality and cyanide
Dry and dry process
Intelligent self rescue and emergency stop function of silicon wafer
> scheduler
> vibrating function of wafer
> dry
Cyanide detector and operator safety protection device
A sealed chemical supply tank
An automatic cleaning system for adjusting the temperature of each process
Lighting system that has no influence on the coating
> for clean room grade 10000 or higher clean room
> total automatic chemical ratio system:
Manually adjusting each different process and batch according to the difference of the product and the reaction time according to the needs
Graphical user interface
> Windows interface
Edit menu
> real time flowchart
Auto save (EOR, ERR, ChemLog, etc.)
> multilevel cipher
Process control ability
Real-time tracking of batch during the whole process
> process parameter tracking, including temperature, flow, resistivity
Concentration automatic control system
Train
Operation, maintenance and process training
General installation parameters
Dimensions: variable x 2150 x 3050 mm (L x D x H)
Line voltage: 3 x 400 VAC
Rated power: 50 Hz
Rated current: 3 x 100 A (etc.)
standard
> FM 4910
> > SEMI S2 and S8
> > SECS/GEM
> CE
Optional
> UPS component
> wafer ID recognition
reliability
MTBF >: > 800 H
> auxiliary average interval: 300 H
Run time: > > 97%
No more automatic electroplating equipment can focus on the Nantong semiconductor equipment website ;
Now consulting can immediately free access to provides automatic electroplating equipment related programs
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