主要特性與技術(shù)指標(biāo)

廣泛的工作條件與精密測(cè)量功能相結(jié)合

適合功率器件表征的綜合解決方案，高達(dá) 1500 A 和 10 kV

中等電流測(cè)量和高電壓偏置（例如，500 mA，1200 V）

μΩ 導(dǎo)通電阻測(cè)量功能

高電壓偏置時(shí)，可進(jìn)行精確的 sub-pA 電平電流測(cè)量

在 -50 ℃ 至 +250 ℃ 溫度范圍內(nèi)進(jìn)行全自動(dòng)熱測(cè)試

廣泛的器件測(cè)量功能

可在高達(dá) 3000 V 直流偏置時(shí)執(zhí)行全自動(dòng)電容測(cè)量（Ciss、Coss、Crss 等）

10 μs 高功率脈沖測(cè)量

封裝器件和晶圓上 IGBT/FET 柵極電荷測(cè)量

高電壓/強(qiáng)電流快速切換選件，適用于 GaN 電流崩塌效應(yīng)表征

多達(dá) 5 個(gè)高電壓（3 kV）電源/測(cè)量通道，提供的靈活性

通過(guò)互鎖測(cè)試夾具執(zhí)行安全的與溫度相關(guān)的測(cè)試

改進(jìn)的測(cè)量效率

在高電壓和強(qiáng)電流測(cè)量之間自動(dòng)切換，無(wú)需重新布線

自動(dòng)測(cè)試電路形成，可用于封裝器件和晶圓上器件的晶體管結(jié)電容（Ciss、Coss、Crss、Cgs、Cgd、Cds 等）測(cè)量

具有互鎖機(jī)制的標(biāo)準(zhǔn)測(cè)試夾具，可進(jìn)行封裝功率器件測(cè)試

支持高達(dá) 200 A 和 10 kV 的高功率晶圓上測(cè)試

示波器視圖支持對(duì)應(yīng)用電壓和電流波形的驗(yàn)證

MS Windows EasyEXPERT 軟件簡(jiǎn)化了數(shù)據(jù)管理和分析流程

Main features and technical indicators

A wide range of working conditions combined with precision measurement functions

Integrated solution for power device characterization up to 1500 A and 10 kV

Medium current measurement and high voltage offset (e.g., 500 mA, 1200 V)

Mu Ω conduction resistance measurement function

Accurate sub-pa level current measurements are performed at high voltage bias

In - 50 ℃ to + 250 ℃ temperature range for automatic test

Wide range of device measurement functions

Automatic capacitance measurement (Ciss, Coss, Crss, etc.) can be performed at dc bias up to 3000 V.

10 s high power pulse measurement

Gate charge measurement of IGBT/FET on packaged devices and wafers

High voltage/strong current fast switching option, suitable for GaN current collapse effect characterization

Up to 5 high voltage (3 kV) power/measurement channels, providing maximum flexibility

Perform safe temperature related tests with interlock test fixtures

Improved measurement efficiency

Automatic switching between high voltage and high current measurements without rewiring

Automatic test circuit is formed, which can be used for measuring transistor junction capacitance (Ciss, Coss, Crss, Cgs, Cgd, Cds, etc.) of packaged devices and devices on wafer

Standard test fixture with interlocking mechanism for testing packaged power devices

Support up to 200 A and 10 kV high power wafer test

The oscilloscope view supports verification of application voltage and current waveforms

MS Windows EasyEXPERT software simplifies the data management and analysis process