波長

Si detector: 190 to 1150 nm
InGaAs detector: 650 to 1800 nm
Si + InGaAs detectors: 190 to 1800 nm
Si + InGaAs (extended) detectors: 190 to 2300 or 2500 nm

可測光斑尺寸

Si detector: 5 µm to 4 mm, to 2 µm in Knife-Edge mode
InGaAs detector: 10 µm to 3 mm, to 2 µm in Knife-Edge mode
InGaAs (extended) detector: 10 µm to 2 mm, to 2 µm in Knife-Edge mode

平面間距 (4XY)

100 µm: -100, 0, +100, +400 µm
250 µm: -250, 0, +250, +1000 µm
500 µm: -500, 0, +500, +2000 µm
750 µm: -750, 0, +750, +3000 µm

平面間距 (3XYKE)

50 µm: -50, 0, +50, 0 µm
100 µm: -100, 0, +100, 0 µm

光斑束腰直徑測量

Second moment (4s) diameter to ISO 11146; Fitted Gaussian & TopHat
1/e2 (13.5%) width
User selectable % of peak
Knife-Edge mode* for very small beams

光斑束腰位置測量

± 20 µm best in X, Y, and Z — contact DataRay for recommendation

可測光源

CW; Pulsed lasers, F µm = [500/(PRR in kHz)]

分辨率/精度

0.1 µm or 0.05% of scan range
± < 2%="" ±="0.5">

M2 測量

1 to > 20, ± 5%

發(fā)散角/準(zhǔn)直,指向性

1 mrad best — contact DataRay for recommendation

功率 & 輻照度

1 W Total & 0.5 mW/µm2

增益范圍

1,000:1 Switched 4,096:1 ADC range

顯示圖形

X-Y-Z Position & Profiles, Zoom x1 to x16

更新速率

~5 Hz

XY輪廓和質(zhì)心

Beam Wander display and logging

電腦硬件要求

Windows, 2 GB RAM, USB 2.0/3.0 port