硅片表面形貌測(cè)量VIT系列

NEW: Virtual Interface Technology for 3D-IC Metrology:
-TSV profile (depth,  bottom CD, tilt, SWA)
-Residue Detection
-RST
-Copper Nail Height
-Bump Height and Cu pillar height
-Edge trim profile

3DIC TSV and BWS TTV硅片表面形貌測(cè)量
Film Stress薄膜應(yīng)力量測(cè)儀
FEOL Electrical Characterization 電學(xué)特性
Thin wafer metrology 晶圓測(cè)量學(xué)
Film Adhesion漆膜附著力測(cè)試NEW: Virtual Interface Technology for 3D-IC Metrology:
-TSV profile (depth,  bottom CD, tilt, SWA)
-Residue Detection
-RST
-Copper Nail Height
-Bump Height and Cu pillar height

-Edge trim profile